Semiconductor Engineering

Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
SiliconANGLE

Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technologies

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
Semiconductor Engineering

Bold Prediction: 50% Of New HPC Chip Designs Will Be Multi-Die In 2025

Monolithic chips have been the workhorses behind decades of technological advancement. But just as the industrial revolution saw workhorses replaced with more efficient and powerful machinery, the ...
TweakTown

This is what 2.5D aka CoWoS advanced packaging looks like: GPU logic die, HBM, interposer

One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...
DIGITIMES

SK Hynix weighs US expansion for advanced chip packaging

According to South Korean technology outlet , SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South Korean memory ...