Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, ...

Broadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads. The new platform relies on TSMC's CoWoS and ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

Apple has been granted a patent for 5D technology, something which as yet apparently does not exist. The patent relates to a wide range of things which include advanced 5D technology, interactive ...

In 2016, progress was made in data storage development as scientists at the University of Southampton successfully developed a 5D memory crystal capable of storing up to 360 terabytes (TB) of data, ...

Apple's latest patent focuses on some crazy 5D technology that can advance TV viewing, gaming, and just about any function. Virtual reality gloves included. Donna Tam covers Amazon and other fun stuff ...

The technology is what is known as five-dimensional (5)D optical storage and it is one the University of Southampton team has been pursuing for a while. It was first demonstrated back in 2013, with ...

Seeing is believing: imaging and visualization capabilities of the iTero Element 5D Imaging System are designed to enable better patient engagement and lead to increased patient acceptance of ...

Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- ...

Combination of 3D silicon stacking and 2.5D packaging technology enables custom compute platforms with breakthrough performance, power and cost PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- ...