A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Monolithic chips have been the workhorses behind decades of technological advancement. But just as the industrial revolution saw workhorses replaced with more efficient and powerful machinery, the ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

According to South Korean technology outlet , SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South Korean memory ...